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The Atomic Step Induced by off Angle CMP Influences the Electrical Properties of the SiC Surface
Abstract:
In this work, we made an off-axis surface of SiC with Mechano-chemical polishing method to examine the influence that an atomic step gave for electronic properties of devices. Low energy ion scattering spectroscopy was shown Si-face and C-face with SiC structure were polished with monocrystal. We consider that there results above the atomic step on the surface influence to a device properties, especially a leakage current of Schottky diode. C atom at the step and terrace cause leakage event at metal-semiconductor interface of Schottky diode have been clarified by conductive atomic force microscopy.
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569-572
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Online since:
May 2012
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© 2012 Trans Tech Publications Ltd. All Rights Reserved
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