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Morphological Instability of 4H-SiC (0001) Basal Plane Surface during Si-Vapor Thermal Etching
Abstract:
The morphological instability appeared at step-free 4H-SiC (0001) surfaces was investigated. The step-free surfaces were fabricated at the bottom of inverted-mesa structure by the method combining a laser digging and Si-vapor etching. By repeated Si-vapor etching treatments, randomly created crater and maze structures were cyclically appeared at the step-free surfaces. These structures were distinctly classifiable by their depths from the step-free surfaces. Crater structures have 0.2 - 0.3 nm depth and maze structures have 0.5 nm depth. The morphological evolutions indicate the process of destruction of the step-free (0001) basal plane and generation of steps from step-free surfaces in the Si-vapor etching process.
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577-580
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Online since:
May 2012
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© 2012 Trans Tech Publications Ltd. All Rights Reserved
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