p.177
p.181
p.185
p.189
p.193
p.197
p.201
p.205
p.209
The Growth of 3-Inch 4H-SiC Si-Face Epitaxial Wafer with Vicinal Off-Angle
Abstract:
We grew epitaxial layers on 3-inch epitaxial wafers with a vicinal off-angle, using a horizontal hot-wall chemical vapor deposition system that had a reactor capacity of 3 x 150 mm. Uniformity (σ/mean) of thickness and carrier concentration as small as 1.7% and 5.6%, respectively, were successfully obtained. We succeeded in decreasing triangular surface defects and polytype inclusions by increasing the growth temperature and lowering the C/Si ratio. In addition, I-V characteristics of Schottky barrier diodes on an epitaxial layer showed that a high blocking voltage of 960 V and a low leakage current of less than 1 x 10-6 A/cm2 were obtained with a yield of 78%.
Info:
Periodical:
Pages:
193-196
Citation:
Online since:
January 2013
Authors:
Keywords:
Price:
Сopyright:
© 2013 Trans Tech Publications Ltd. All Rights Reserved
Share:
Citation: