A Comparison of Free Carrier Absorption and Capacitance Voltage Methods for Interface Trap Measurements

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This paper aims to establish a new method to characterize the interface between 4H-SiC and passivating dielectric layers. The investigations are made on MOS test structures utilizing Al2O3 and SiO2 dielectrics on 4H-SiC. These devices are then exposed to various fluences of Ar+ implantation and then measured by the new method utilizing optical free carrier absorption (FCA) technique to assess the interface traps. A program has been developed using MATLAB to extract surface recombination velocity (SRV) at the oxide/epi-layer interface from the optical data. Capacitance-voltage (CV) is done to extract the density of interface traps (Dit) and a comparison was made. It is observed that SiO2 samples show a large rise of SRVs, from 0.5×104 cm/s for a reference sample to 8×104 cm/s for a fluence of 1×1012 cm-2, whereas Al2O3 samples show more stable SRV, changing from 3×104 cm/s for the un-irradiated reference sample to 6×104 cm/s for a fluence of 1×1012 cm-2. A very similar trend is observed for Dit values extracted from CV measurements and it can therefore be concluded that the FCA method is a suitable technique for the interface characterization.

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Materials Science Forum (Volumes 740-742)

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465-468

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January 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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