Fast Growth Rate Epitaxy on 4° Off-Cut 4-Inch Diameter 4H-SiC Wafers

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Abstract:

We report the development of over 100 μm/h growth rate process on 4-inch diameter wafers using chlorinated growth. The optimized growth process has shown extremely smooth epilayers completely free of surface step-bunching with very low surface defect density, high uniformity in thickness and doping and high run to run reproducibility in growth rate, controlled doping and defect density.

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Periodical:

Materials Science Forum (Volumes 778-780)

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179-182

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February 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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DOI: 10.1002/cvde.200506465

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