Reliability Evaluation of SiC Power Device Package Used Heat-Resistant Molding Plastic by Power Cycle Test

Tsuyoshi Funaki; Akihiro Yasui

doi:10.4028/www.scientific.net/MSF.858.1049

Paper Titles

Solar Driven Energy Conversion Applications Based on 3C-SiC
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Ion Implanted 4H-SiC UV Pin-Diodes for Solar Radiation Detection – Simulation and Characterization
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Structural Optimization of 4H-SiC BJT for Ultraviolet Detection with High Optical Gain
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History and Recent Developments of Packaging Technology for SiC Power Devices
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Reliability Evaluation of SiC Power Device Package Used Heat-Resistant Molding Plastic by Power Cycle Test
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Studies on Floating Contact Press-Pack Diodes Surge Current Capability
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Impact of Package Parasitics on Switching Performance
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Investigation of Pressure Dependent Thermal Contact Resistance between Silver Metallized SiC Chip and Molybdenum Substrate and between Molybdenum Substrate and Bulk Copper
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Development of a Wire-Bonding-Less SiC Power Module Operating over a Wide Temperature Range
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HomeMaterials Science ForumMaterials Science Forum Vol. 858Reliability Evaluation of SiC Power Device Package...

Reliability Evaluation of SiC Power Device Package Used Heat-Resistant Molding Plastic by Power Cycle Test

Abstract:

SiC power device can operate in temperature higher than 200°C, where conventional Si power device cannot operate normally. The heat-resistant package is required to ensure the reliability in high temperature operation of SiC power device. This study evaluates the reliability of developed package for high temperature operation in power cycle test. The given power cycle condition is ΔTj=170°C with Tj=200°C for high temperature and Tj=30°C for low temperature. The device in the package with Al₂O₃-ceramic fails for 3387 power cycle test, but it is necessary to further analyze failure mechanism

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Periodical:

Materials Science Forum (Volume 858)

Pages:

1049-1052

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.858.1049

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Online since:

May 2016

Authors:

Tsuyoshi Funaki, Akihiro Yasui*

Keywords:

Heat-Resistant Encapsulation, High-Temperature, Power Cycle Test, Reliability

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References

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