Novel Carbon Treatment to Create an Oriented 3C-SiC Seed on Silicon

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In this contribution we investigate the possibility to obtain an oriented 3C-SiC seed on Si substrate “pre-carbonized” through Plasma Immersion Ion Implantation (PIII) process by combining PIII with high temperature annealing.

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153-156

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July 2019

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© 2019 Trans Tech Publications Ltd. All Rights Reserved

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[1] J.A. Borders, S.T. Picraux, and W. Beezhold, Applied Physics Letters 18, 509 (1971).

Google Scholar

[2] K. Srikanth et al, Thin Solid Films, 163, 323 (1988).

Google Scholar

[3] K. Kh. Nussupov et al, Physics of the Solid State, 56, 2307 (2014).

Google Scholar

[4] A. Anders, Surface and Coatings Technology 93, 158 (1997).

Google Scholar

[5] S.B Felch, F. Torregrosa, H. Etienne, Y. Spiegel, L. Roux, D. Turnbaugh, PULSION® HP, Tunable, High productivity Plasma Doping. IIT 2010 Kyoto, Japan. AIP Conference proceedings 1321, 333 (2011).

DOI: 10.1063/1.3548413

Google Scholar

[6] information on http://www.sil-tronix-st.com/accueil.

Google Scholar

[7] M. Zielinski et al, Materials Science Forum 924, 306 (2018).

Google Scholar