Metrology and Removal of Nanoparticles from 500 Micron Deep Trenches

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Periodical:

Solid State Phenomena (Volumes 103-104)

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137-140

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Online since:

April 2005

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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[2000] ,pp.199-204. 5. Zhang, F. and Busnaina, A. A., "Submicron Particle Removal in Post-oxide Chemicalmechanical Planarization (CMP) Cleaning" J of Applied Physics A 69 (1999) 4, 437-440.

DOI: 10.1007/s003390051028

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