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HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Using Megasonics for Particle and Residue Removal...

Using Megasonics for Particle and Residue Removal in Single Wafer Cleaning

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Abstract:

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Ultra Clean Processing of Silicon Surfaces VII

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

151-154

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.151

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Online since:

April 2005

Authors:

Steven Verhaverbeke, Roman Gouk, Dennis Yost

Keywords:

Megasonics, Poly-Line Damage, Single Wafer Clean

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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