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HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Damage-Free Cleaning of Sub-50 nm Devices Using...

Damage-Free Cleaning of Sub-50 nm Devices Using Directed Megasonics Technology in a Single Wafer Processor

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Ultra Clean Processing of Silicon Surfaces VII

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

167-170

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.167

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Online since:

April 2005

Authors:

J.J. Rosato, M.R. Yalamanchili, M.J. Beck, R.Y. Lillard

Keywords:

Megasonics Damage, Particle Removal Efficiency, Single Wafer Cleaning

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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[2] A. Tomozawa et. al., Proc. Of Cleaning Tech. in Semi Manuf. VI, 1999), Electrochem. Soc., p.537.

[3] F. H. Sanders, Can. J. of Res., 17(9), (1939), p.179