Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis

Hidekazu Hayashi; Ken Tsugane; Yasushi Kagoshima; Takahisa Koyama; Masaharu Watanabe; Yasushi Kozuki

doi:10.4028/www.scientific.net/SSP.103-104.217

Paper Titles

Non-Damaging CO₂ Aerosol Cleaning in FEOL IC Manufacturing
p.199

Particle Adhesion on Tool Kit Part: Case Study for Ceramic Material
p.203

Simultaneous Analysis of Light and Heavy Organic Contamination on Silicon Wafer
p.209

VPD-DC-TXRF for Metallic Contamination Analysis of Ge Wafers
p.213

Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis
p.217

Application of HPLC for the Analysis of Organic Additives in Cleaning Chemicals and Cleaning Mixtures
p.221

Chromium Contamination in Silicon: Detection and Impact on Oxide Performances
p.227

Further Reduction of Trace Level Ion from Ultra Pure Water and Its Effect on Electrical Property of Device
p.233

Prevention of Copper Cross-Contamination on Cu Process and Non-Cu Process Mixed Fabrication
p.237

HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Cu Spin Cleaning Evaluation by SOR X-Ray...

Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis

Abstract:

Cu contamination control is critically important in Cu interconnect device manufacturing lines. The frontside gas protected spin cleaning enables the effective removal of the Cu contaminant from the backside and bevel of a wafer. A small area on the bevel was measured for cleaning efficiency using SOR (Synchrotron Orbital Radiation) X-ray fluorescence. The atomic level Cu removal was detected on the bevel surface with the barrier metal Ta existing wafers. The high energy SOR X-ray analysis makes it possible to measure the Cu contamination, where conventional methods do not work.

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

217-220

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.217

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Online since:

April 2005

Authors:

Hidekazu Hayashi, Ken Tsugane, Yasushi Kagoshima, Takahisa Koyama, Masaharu Watanabe, Yasushi Kozuki

Keywords:

Copper (Cu), Single Wafer Cleaning, SOR, X-Ray Fluorescence (XRF)

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