Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis

Abstract:

Article Preview

Cu contamination control is critically important in Cu interconnect device manufacturing lines. The frontside gas protected spin cleaning enables the effective removal of the Cu contaminant from the backside and bevel of a wafer. A small area on the bevel was measured for cleaning efficiency using SOR (Synchrotron Orbital Radiation) X-ray fluorescence. The atomic level Cu removal was detected on the bevel surface with the barrier metal Ta existing wafers. The high energy SOR X-ray analysis makes it possible to measure the Cu contamination, where conventional methods do not work.

Info:

Periodical:

Solid State Phenomena (Volumes 103-104)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

217-220

DOI:

10.4028/www.scientific.net/SSP.103-104.217

Citation:

H. Hayashi et al., "Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis", Solid State Phenomena, Vols. 103-104, pp. 217-220, 2005

Online since:

April 2005

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.