Prevention of Copper Cross-Contamination on Cu Process and Non-Cu Process Mixed Fabrication

Joon Bum Shim; Kang Hyun Lee; Kee Ho Kim; Heung Soo Park

doi:10.4028/www.scientific.net/SSP.103-104.237

Paper Titles

Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis
p.217

Application of HPLC for the Analysis of Organic Additives in Cleaning Chemicals and Cleaning Mixtures
p.221

Chromium Contamination in Silicon: Detection and Impact on Oxide Performances
p.227

Further Reduction of Trace Level Ion from Ultra Pure Water and Its Effect on Electrical Property of Device
p.233

Prevention of Copper Cross-Contamination on Cu Process and Non-Cu Process Mixed Fabrication
p.237

Wafer Backside Cleaning Strategies for High-k/Metal Gate Processing
p.241

Direct Mixing Cleaning Method of Aqua Regia on Wafer
p.245

Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide
p.249

The Degradation Prevention of Resin Materials for Semiconductor Manufacturing Equipment by Applying the Ultra-High Purity Gas Supply Technology
p.255

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Prevention of Copper Cross-Contamination on Cu Process and Non-Cu Process Mixed Fabrication

Abstract:

When the integration of Cu process and non-Cu process is mixed in the fabrication, the prevention of Cu cross-contamination between wafer-to-wafer and machine-to-machine is critical. This study suggests a prevention method of the cross-contamination in Cu fabrication line.