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Wafer Backside Cleaning Strategies for High-k/Metal Gate Processing
Abstract:
In this work the removal of different metallic and particulate contaminants relevant for high-k/metal gate processing is studied. Best cleaning efficiency of both silicon and nitride substrates is achieved using a HF/HNO3-based cleaning resulting in a particle removal efficiency higher than 90% and metal removal down to 1010 at/cm2.
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241-244
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Online since:
April 2005
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© 2005 Trans Tech Publications Ltd. All Rights Reserved
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