Wafer Backside Cleaning Strategies for High-k/Metal Gate Processing

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Abstract:

In this work the removal of different metallic and particulate contaminants relevant for high-k/metal gate processing is studied. Best cleaning efficiency of both silicon and nitride substrates is achieved using a HF/HNO3-based cleaning resulting in a particle removal efficiency higher than 90% and metal removal down to 1010 at/cm2.

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Periodical:

Solid State Phenomena (Volumes 103-104)

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241-244

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April 2005

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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