Effects of Patterns on Corrosion in Cu CMP

Ja Hyung Han; Ja Eung Koo; Duk Ho Hong; Byung Lyul Park; Seong Il Kim; In-Soo Cho; Dae Hong Eom; Jin Goo Park; Ahmed A. Busnaina

doi:10.4028/www.scientific.net/SSP.103-104.369

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HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Effects of Patterns on Corrosion in Cu CMP

Effects of Patterns on Corrosion in Cu CMP

Abstract:

Corrosion on specific Cu patterns was evaluated during Cu CMP. The corrosion was observed at isolated patterns and outer edge area of pad surrounded by oxide field after polishing and showed dependency on process. Two different commercial slurries were chosen and used for polishing after characterizing electrochemical and frictional properties. Stress simulations were conducted on these patterns. Higher stress was calculated on these patterns. The process temperature and friction behavior of Cu affected the magnitude of corrosion on Cu on these patterns.

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

369-372

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.369

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Online since:

April 2005

Authors:

Ja Hyung Han, Ja Eung Koo, Duk Ho Hong, Byung Lyul Park, Seong Il Kim, In-Soo Cho, Dae Hong Eom, Jin Goo Park, Ahmed A. Busnaina

Keywords:

Corrosion, Cu CMP, Friction, Pattern Dependence

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References

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