New Post Etch Polymer Removal Process for Al-Interconnects and Vias in Tank and Spray Tools Using a New Inorganic Chemistry

Abstract:

A Post-Etch-Residue (PER) removal process for tank and spray tools has been developed using a new inorganic aqueous based chemistry. The performance of this new type of polymer remover, Inosolv 400 Fotopur®, on process wafers is compared with other inorganic chemistries such as DSP (Dilute Sulphuric acid hydrogen Peroxide) and DSP+, containing traces of HF. Inosolv 400 Fotopur® has improved polymer removal capabilities. Furthermore Inosolv 400 Fotopur® does not show any attack of the metal or dielectric layers and is inorganic based and thus environmentally friendly.

• Periodical: Solid State Phenomena (Volumes 103-104)
• Pages: 381-384
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.103-104.381
• Online since: April 2005
• Authors: Raimund Mellies, Stefan Kunz, Franz Nilius, Dieter Mayer, Andreas Kühner
• Keywords: Al-Interconnects, Dilute Sulfuric Peroxide DSP, ESH, Post-Etch-Residue Removal, Spray-Tool, Vias, Wet-Bench

References

[1] D.L. Rath et al., "New Aqueous Clean for Aluminium Interconnects Part I. Fundamentals", Proc. 5th Int. Symp. on UCPSS, 51, (2000).

[2] R. Ravikumar, et al., "New Aqueous Clean for Aluminum Interconnects Part II. Applications", Proc. 5th Int. Symp. on UCPSS, 31, (2000).