Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow
p.353
p.353
Via Cleaning Technology for Post Etch Residues
p.357
p.357
Barrier and Copper Seedlayer Wet Etching
p.361
p.361
Deposition Behavior of Volatile Acidic Contaminants on Metallic Interconnect Surfaces
p.365
p.365
Effects of Patterns on Corrosion in Cu CMP
p.369
p.369
Advanced Aqueous Cleaner II: PER Removal from Sensitive Cu/Low-k Devices
p.373
p.373
Advanced Aqueous Cleaner I, Dilute Solutions for the Selective Removal of Post Etch Residues in the Presence of Aluminium
p.377
p.377
New Post Etch Polymer Removal Process for Al-Interconnects and Vias in Tank and Spray Tools Using a New Inorganic Chemistry
p.381
p.381
Effective Polymer Removal: Process Window-Process Uniformity-Extended Chemical Bath-Life
p.385
p.385
Advanced Aqueous Cleaner I, Dilute Solutions for the Selective Removal of Post Etch Residues in the Presence of Aluminium
Abstract:
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Periodical:
Solid State Phenomena (Volumes 103-104)
Pages:
377-380
Citation:
Online since:
April 2005
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© 2005 Trans Tech Publications Ltd. All Rights Reserved
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