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HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Effective Rinse Aiming at Water-Mark-Free Drying...

Effective Rinse Aiming at Water-Mark-Free Drying for Single-Spin Wet Cleaning Process

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Abstract:

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Ultra Clean Processing of Silicon Surfaces VII

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

79-82

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.79

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Cite this paper

Online since:

April 2005

Authors:

Katsuhiko Miya, Takuya Kishimoto, Akira Izumi

Keywords:

HF Process, Single Wafer Cleaning, Wafer Drying, Water Mark, Wet Cleaning

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Сopyright:

© 2005 Trans Tech Publications Ltd. All Rights Reserved

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Citation:

[1] Yoshihiro Ogawa et al.: Extended abstracts of SSDM,2001 pp.22-23.

[2] K. Miya et al.: Proc. 8th Intern. Symp. Cleaning Technol. in Semicond. Dev. Manufacturing, Electrochemical Societ PV 2003-26, 2004, p.57.

[3] M. Watanabe et al.: Mater. science and engineering B4 p.401