Gettering Mechanism of Cu in Silicon Calculated from First Principles

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Abstract:

The binding energy between 3d transition metals (TM) such as iron (Fe), nickel (Ni) and copper (Cu), and boron (B) in Si are studied using first-principles molecular dynamics method. The binding energies of between each TM for Fe, Ni, Cu and B are 0.64,0.57,and 0.44eV respectively, and the binding energy of Fe and B is the largest, on the other hand, binding energy of Ni and B is the smallest. This result is well in agreement with the experiment fact that Fe and Cu exist as a positive charge in P+ silicon, so it is easy to combine with the B, which has a negative charge, on the other hand, Ni exists in the state of neutrality electrically in P+ silicon, so it can not combine with B atom.

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Periodical:

Solid State Phenomena (Volumes 108-109)

Pages:

115-124

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Online since:

December 2005

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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