Influence of the Process Conditions of a Polishing Rinse after CuCMP

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Periodical:

Solid State Phenomena (Volume 134)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

375-378

DOI:

10.4028/www.scientific.net/SSP.134.375

Citation:

A. Filippini et al., "Influence of the Process Conditions of a Polishing Rinse after CuCMP", Solid State Phenomena, Vol. 134, pp. 375-378, 2008

Online since:

November 2007

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$35.00

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