Monitoring System for Airborne Molecular Contamination (AMC) in Semiconductor Manufacturing Areas and Micro-Environments

Michael Otto; Andreas Leibold; Lars Wulf; Matthias Hurlebaus; Lothar Pfitzner

doi:10.4028/www.scientific.net/SSP.145-146.135

Paper Titles

Metallic Contamination Control in Leading-Edge ULSI Manufacturing
p.115

Molybdenum Contamination in Silicon: Detection and Impact on Device Performances
p.123

Developing a High Volume Manufacturing Wet Clean Process to Remove BF₂ Implant Induced Molybdenum Contamination
p.127

Impact of Metal-Ion Contaminated Silica Particles on Gate Oxide Integrity
p.131

Monitoring System for Airborne Molecular Contamination (AMC) in Semiconductor Manufacturing Areas and Micro-Environments
p.135

Reduction of Airborne Molecular Contamination on 300 mm Front Opening Unified POD (FOUP) and Wafers Surface by Vacuum Technology
p.139

Study of the Volatile Organic Contaminants Absorption and their Reversible Outgassing by FOUPs
p.143

Prevention of Condensation Defects on Contact Patterns by Improving Rinse Process
p.151

Single Wafer Ozone-Based Processing for Effective Edge Fluoropolymer Cleaning
p.155

HomeSolid State PhenomenaSolid State Phenomena Vols. 145-146Monitoring System for Airborne Molecular...

Monitoring System for Airborne Molecular Contamination (AMC) in Semiconductor Manufacturing Areas and Micro-Environments

Abstract:

As a result of shrinking dimensions and technology nodes, nanoelectronics manufacturing and handling processes demand growing requirements to the cleanliness of the air inside cleanrooms and microenvironments. Besides the limitation of particle contamination, the limitation of airborne molecular contamination (AMC) is necessary to ensure yield and quality of nanoelectronics production lines.