Study of the Volatile Organic Contaminants Absorption and their Reversible Outgassing by FOUPs

Hervé Fontaine; Sylviane Cetre; Marc Veillerot; Adrien Danel

doi:10.4028/www.scientific.net/SSP.145-146.143

Paper Titles

Developing a High Volume Manufacturing Wet Clean Process to Remove BF₂ Implant Induced Molybdenum Contamination
p.127

Impact of Metal-Ion Contaminated Silica Particles on Gate Oxide Integrity
p.131

Monitoring System for Airborne Molecular Contamination (AMC) in Semiconductor Manufacturing Areas and Micro-Environments
p.135

Reduction of Airborne Molecular Contamination on 300 mm Front Opening Unified POD (FOUP) and Wafers Surface by Vacuum Technology
p.139

Study of the Volatile Organic Contaminants Absorption and their Reversible Outgassing by FOUPs
p.143

Prevention of Condensation Defects on Contact Patterns by Improving Rinse Process
p.151

Single Wafer Ozone-Based Processing for Effective Edge Fluoropolymer Cleaning
p.155

Cleanliness Management in Advanced Microelectronic
p.159

Surface Preparation and Passivation of III-V Substrates for Future Ultra-High Speed, Low Power Logic Applications
p.165

HomeSolid State PhenomenaSolid State Phenomena Vols. 145-146Study of the Volatile Organic Contaminants...

Study of the Volatile Organic Contaminants Absorption and their Reversible Outgassing by FOUPs

Abstract:

Today, the use of Pods or FOUPs (Front Opening Universal Pod) in IC manufacturing leads to specific molecular contamination issues related to the enclosed environment made with porous polymers (mainly PEEK, PC and PP) that constitute these containers. Indeed, such materials are known to outgass airborne molecular contaminants (AMC), especially polymers additives [1,2]. They are also able to absorb volatile compounds present in their atmosphere coming from the connection to an equipment or from the release of wafers just processed [3,4]. As a result, a reversible outgassing of species previously trapped in plastic is possible. This is especially critical in presence of wafers sensitive to the released contaminants leading then to potential detrimental impacts. This cross-contamination scheme was clearly evidenced for volatile acids in presence of Cu layers leading to corrosion issues [4].