Effect of Dissolved Oxygen for Advanced Wet Processing

Yukifumi Yoshida; Masayuki Otsuji; Hiroaki Takahashi; Jim Snow; Farid Sebaai; Frank Holsteyns; Paul W. Mertens; Masanobu Sato; Hajime Shirakawa; Hirofumi Uchida

doi:10.4028/www.scientific.net/SSP.219.85

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Wet Etch Rate Behavior of Poly-Si in TMAH Solution at Various Ambient Gas Conditions
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Effect of Dissolved Oxygen for Advanced Wet Processing
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HomeSolid State PhenomenaSolid State Phenomena Vol. 219Effect of Dissolved Oxygen for Advanced Wet...

Effect of Dissolved Oxygen for Advanced Wet Processing

Abstract:

of these new materials have necessitated the evaluation of new chemicals and processing methods. The control of the Dissolved Oxygen (DO) concentration to suppress Cu corrosion is well established in BEOL processing and likewise in order to achieve a hydrophobic surface after pre-epi cleaning in FEOL surface preparation [2].

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Periodical:

Solid State Phenomena (Volume 219)

Pages:

85-88

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.219.85

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Online since:

September 2014

Authors:

Yukifumi Yoshida*, Masayuki Otsuji, Hiroaki Takahashi, Jim Snow, Farid Sebaai, Frank Holsteyns, Paul W. Mertens, Masanobu Sato, Hajime Shirakawa, Hirofumi Uchida

Keywords:

Dissolved Oxygen, Etching, Galvanic Corrosion, Ge, RMG

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References

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