Pattern Collapse-Free Drying with Sacrificial Gap Fill Polymers

Desaraju Varaprasad; Songyuan Xie; Evelyn Kennedy; Amanuel Gebrebrhan; Hongmin Huang; Joseph  Kennedy

doi:10.4028/www.scientific.net/SSP.282.194

Paper Titles

Fixed Charge Control of Silylated Surface for Stiction-Free Drying with Surface Energy Reduction Process
p.168

Exploring Wetting Dynamics on Superhydrophobic Nanopatterned Surfaces Using ATR-FTIR
p.175

Effect of 1-D Nano-Confinement on the Kinetics of a Click-Chemistry Surface Reaction Used in Biosensors
p.182

Cleaning of High Aspect Ratio STI Structures for Advanced Logic Devices by Implementation of a Surface Modification Drying Technique
p.190

Pattern Collapse-Free Drying with Sacrificial Gap Fill Polymers
p.194

Factors Influencing Drying Induced Pattern Collapse
p.201

300 mm Wafer Development for Pattern Collapse Evaluations
p.207

AlCu Pitting Prevention in Post Etch Cleaning
p.213

Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool
p.220

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Pattern Collapse-Free Drying with Sacrificial Gap Fill Polymers

Abstract:

This work discusses pattern collapse-free drying by application of a sacrificial polymer during the semiconductor wafer cleaning process. The sacrificial polymer is dispensed onto the wafer, displacing the rinse liquid and subsequently dried to form a solid polymer fill within the patterned structure, providing both mechanical support and a means for dry polymer removal by either plasma or thermal exposure. Polymer film thickness, gap fill capability and removal rate are explored for plasma ashable and thermally removable polymer families.

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Periodical:

Solid State Phenomena (Volume 282)

Pages:

194-200

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.282.194

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Online since:

August 2018

Authors:

Desaraju Varaprasad, Songyuan Xie, Evelyn Kennedy, Amanuel Gebrebrhan, Hongmin Huang, Joseph Kennedy

Keywords:

Collapse, Drying, Gap Fill, Mitigation, Pattern, Polymer

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