Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool

Ivan Venegoni; Silvia Brazzelli; Roberta Gomarasca; Francesco Pipia; Mauro Alessandri

doi:10.4028/www.scientific.net/SSP.282.220

Paper Titles

Pattern Collapse-Free Drying with Sacrificial Gap Fill Polymers
p.194

Factors Influencing Drying Induced Pattern Collapse
p.201

300 mm Wafer Development for Pattern Collapse Evaluations
p.207

AlCu Pitting Prevention in Post Etch Cleaning
p.213

Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool
p.220

Aluminum Cleaning on Single Wafer Tool: A Case Study with Diluted HF
p.226

Atomic Layer Deposition of TiN below 600 K Using N₂H₄
p.232

Process Parameter Control for BEOL TiN Hard Mask Etch-Back
p.238

BEOL Post-Etch Clean Robustness Improvement with Ultra-Diluted Hf for 28nm Node
p.244

HomeSolid State PhenomenaSolid State Phenomena Vol. 282Investigation of Defectivity Coming from the Back...

Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool

Abstract:

The defectivity of a batch process for polymer removal in AlCu BEOL technology has been investigated, reasearching the defectivity source and studying the composition of the defects. Different solutions for the minimization of this defectivity have been found, working on the positioning of the wafers or additional cleanings. The complete eradication of the defectivity has also been demonstrated performing the process on a single wafer tool.

You might also be interested in these eBooks

Ultra Clean Processing of Semiconductor Surfaces XIV

View Preview

Info:

Periodical:

Solid State Phenomena (Volume 282)

Pages:

220-225

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.282.220

Citation:

Cite this paper

Online since:

August 2018

Authors:

Ivan Venegoni*, Silvia Brazzelli, Roberta Gomarasca, Francesco Pipia, Mauro Alessandri

Keywords:

AlCu, Back Side, Back-End, Defectivity, Flakes, Polymer, Scrubber, Spacing

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] D. F. Hilscher, D. Jaeger, C. DeWan, M. Brodsky, R. Rettmann, Single Wafer Cleaning Lessons in Advanced Node Gate Module Development, ASMC (2013).

DOI: 10.1109/asmc.2013.6552757

Google Scholar

[2] L. Wilson, E. Brown, Single-Wafer and Mini-Batch Wet Processing for Improved Process Performance and Process Characterization, 1995 International Symposium on Semiconductor Manufacturing.

DOI: 10.1109/issm.1995.524393

Google Scholar

[3] P. Garnier, T. Vessa, A. S. Larrea, B. Pernet, Gate Oxide Cleans On Single Wafer Cleaning Tool, 212th ECS Transactions, September (2007).

DOI: 10.1149/1.2779387

Google Scholar

[4] T. Couteau, G. Dawson, J. Halladay, L. Archer, Single-Wafer vs. Batch Wet Surface Preparation in BEOL: a Comparison of Polymer Cleans using Inorganic Chemicals in Flash Memory Production, 2006 IEEE/SEMI Advanced Semiconductor Manufacturing Conference.

DOI: 10.1109/asmc.2006.1638771

Google Scholar

[5] M.C. Silvestre, E. Ramanathan, S. Hildreth, Bevel Rinse Optimization for Reduced Edge Defectivity and Improved Edge Yield, ASMC (2016).

DOI: 10.1109/asmc.2016.7491136

Google Scholar

[6] C. Bunke, T.F. Houghton, K. Bandy, G. Stojakovic, G. Fang, Bevel RIE Application to Reduce Defectivity in Copper BEOL Processing, IEEE transactions on semiconductor manufacturing, vol. 26, November (2013).

DOI: 10.1109/asmc.2012.6212869

Google Scholar