Determination of HCl Transport Coefficients in Real FOUP Polymers for HCl Cross-Contamination Assessment from FOUP to Wafer

Minh Phuong Tran; Paola González-Aguirre; Carlos Beitia; Jorgen Lungren; Sung In Moon; Hervé Fontaine

doi:10.4028/www.scientific.net/SSP.282.321

Paper Titles

Post-CMP Cleaners for Tungsten Advanced Nodes: 10nm and 7nm
p.278

Wet-Chemical Etching of Ruthenium in Acidic Ce⁴⁺ Solution
p.284

Versatile Aqueous Chemistry for Selective Ru or WNx Etch and Implant BARC Removal in 5- and 3-nm Applications
p.288

Impact of Controlled Ni Contamination on Silicon Solar Wafer Material
p.295

Wet Processing in State-of-the-Art Cu(In,Ga)(S,Se)₂ Thin Film Solar Cells
p.300

Influence of VPT Treatment on Microscopic Distribution of Trace Metal Contaminants and its Effect on TXRF Measurement
p.309

Advanced Data Analysis Strategies for Understanding Particle Contamination in Chemical Distribution Systems
p.314

Determination of HCl Transport Coefficients in Real FOUP Polymers for HCl Cross-Contamination Assessment from FOUP to Wafer
p.321

Yield Enhancement due to Addition of Bevel Cleans at Middle of Line(MOL) Zone
p.329

HomeSolid State PhenomenaSolid State Phenomena Vol. 282Determination of HCl Transport Coefficients in...

Determination of HCl Transport Coefficients in Real FOUP Polymers for HCl Cross-Contamination Assessment from FOUP to Wafer

Abstract:

The HCl transport coefficients of commercial FOUPs made of polymers such as polycarbonate (PC), Entegris Barrier Material (EBM) and composite of Entegris Barrier Material/carbon nanotubes (EBMCNT)) were experimentally determined by the sorption kinetic method taking into account the surface effect. Afterward, these transport coefficients were used as input data for the membrane polymer model. The HCl concentration profiles within different FOUPs polymers were simulated in different contamination scenarios, queue time and purge steps. Having the polar group in polymeric chains, PC showed a higher affinity to HCl rather than EBM and EBMCNT, leading to a higher HCl diffusivity. According to simulation data, the HCl contaminant, therefore, penetrates deeper into FOUPs walls made of PC. In contrary, the EBM and EBMCNT have low HCl penetrating depth and the total HCl uptake mass is mostly present near the surface (< 20 µm) for EBM and EBMCNT. In addition, the transferred HCl onto Cu-coated wafers stored in PC and EBMCNT FOUPs was also discussed and compared.

You might also be interested in these eBooks

Ultra Clean Processing of Semiconductor Surfaces XIV

View Preview

Info:

Periodical:

Solid State Phenomena (Volume 282)

Pages:

321-328

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.282.321

Citation:

Cite this paper

Online since:

August 2018

Authors:

Minh Phuong Tran, Paola González-Aguirre, Carlos Beitia, Jorgen Lungren, Sung In Moon, Hervé Fontaine

Keywords:

Airborne Molecular Contamination (AMC), Chlorohydric Acid, Copper Wafer, FOUPs, Transport Coefficient

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] B. J. Wu, H. Bai, I. K. Lin, and S. S. Liu, Al #x2013;Cu Pattern Wafer Study on Metal Corrosion Due to Chloride Ion Contaminants,, IEEE Trans. Semicond. Manuf., vol. 23, no. 4, p.553–558, Nov. (2010).

DOI: 10.1109/tsm.2010.2061972

Google Scholar

[2] H. Fontaine, Y. Borde, C. Brych, and A. Danel, Characterization of the HCl Absorption & Outgassing Mechanisms by FOUPs' Polymers,, ECS Trans., vol. 25, no. 5, p.139–146, Sep. (2009).

DOI: 10.1149/1.3202646

Google Scholar

[3] H. Fontaine and M. Veillerot, Plastic Containers Contamination by Volatile Acids : Accumulation, Release and Transfer to Cu-Surfaces during Wafers Storage,, in Ultra Clean Processing of Semiconductor Surfaces VIII, 2008, vol. 134, p.251–254.

Google Scholar

[4] P. González-Aguirre, H. Fontaine, C. Beitia, J. Ohlsen, J. Lundgren, and P. Lee, A comparative study of the HF sorption and outgassing ability of different Entegris FOUP platforms and materials,, Microelectron. Eng., vol. 105, p.113–118, May (2013).

DOI: 10.1016/j.mee.2012.12.005

Google Scholar

[5] N. Santatriniaina, J. Deseure, T. Q. Nguyen, H. Fontaine, C. Beitia, and L. Rakotomanana-Ravelonarivo, Mathematical Modeling of the AMCs Cross-Contamination Removal in the FOUPs: Finite Element Formulation and Application in FOUP Decontamination,, Int. J. Math. Comput. Stat. Nat. Phys. Eng., vol. 8, no. 4, p.662–667, (2014).

DOI: 10.14419/ijamr.v3i3.2829

Google Scholar

[6] P. González-Aguirre, H. Fontaine, C. Beitia, R. Pastorello, J. Ohlsen, and J. Lundgren, HF Transport Coefficients in Polymers Used for Microelectronic Applications,, Defect and Diffusion Forum, 2016. [Online]. Available: https://www.scientific.net/DDF.367.68. [Accessed: 18-Jun-2018].

DOI: 10.4028/www.scientific.net/ddf.367.68

Google Scholar

[7] F. Herrán, P. González-Aguirre, C. Beitia, J. Ohlsen, J. Lundgren, and H. Fontaine, Comparison of HF and HCl cross-contamination between different ENTEGRIS FOUP platforms and Cu-coated wafers,, Microelectron. Eng., vol. 169, p.34–38, Feb. (2017).

DOI: 10.1016/j.mee.2016.11.017

Google Scholar