Growth of 8-Inch SiC Single Crystals with Low Basal Plane Dislocation Density

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Abstract:

Silicon Carbide (SiC) is a pivotal wide-bandgap semiconductor for high-power and high-frequency electronics. However, crystalline defects, particularly Basal Plane Dislocations (BPDs), severely degrade the performance and reliability of bipolar devices by nucleating stacking faults that cause fatal forward voltage drift. This work presents the successful growth of 8-inch, 4° off-axis, n-type 4H-SiC single crystals with significantly reduced BPD density via the Physical Vapor Transport (PVT) method using an improved reactor design. The key innovation involves replacing traditional graphite components with single or polycrystalline SiC for the seed holder and guide tube, subsequently coated with a thin (10 µm) tantalum carbide (TaC) film. This design ensures thermal expansion coefficient matching and reduces thermal radiation emissivity. Etch pit density analysis revealed that the improved design reduced the overall BPD density from over 1027 cm⁻² to a remarkably low 78 cm⁻². Furthermore, it drastically improved the radial uniformity of BPD distribution by stabilizing the thermal gradient and suppressing parasitic polycrystalline nucleation, marking a critical advancement towards high-yield production of high-quality, large-diameter SiC substrates.

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