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Development of High Concentration Uniformity Epitaxial Growth on 200 mm 4H-SiC Wafers
Abstract:
This study focuses on addressing the challenge of poor doping concentration uniformity during the epitaxial growth of 200 mm 4H-SiC substrates, which is primarily caused by difficulties in thermal field and flow field control. By systematically optimizing key process parameters, including H2 flow rate, C/Si ratio, and growth temperature, a high uniformity concentration technology was developed. This technology has enabled a breakthrough in the performance of n-type epitaxial layers, with the doping concentration uniformity significantly improved to 0.67%. Based on the validation of this technology—encompassing 8,000 epitaxial wafers and thick epitaxial layers (≥30 μm)—the technology demonstrates excellent doping concentration uniformity. This research provides a reliable technical foundation for the large-scale application of large-size SiC materials in power devices.
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21-25
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May 2026
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