Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers

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Periodical:

Solid State Phenomena (Volumes 76-77)

Edited by:

Marc Heyns, Marc Meuris and Paul Mertens

Pages:

173-176

DOI:

10.4028/www.scientific.net/SSP.76-77.173

Citation:

W.A. Nevin et al., "Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers", Solid State Phenomena, Vols. 76-77, pp. 173-176, 2001

Online since:

January 2001

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$35.00

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