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HomeSolid State PhenomenaSolid State Phenomena Vols. 76-77Influence of Cleaning on the Quality of the...

Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers

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Ultra Clean Processing of Silicon Surfaces V

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Periodical:

Solid State Phenomena (Volumes 76-77)

Pages:

173-176

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.76-77.173

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Online since:

January 2001

Authors:

W.A. Nevin, D.L. Gay, G. O'Neill

Keywords:

Impurity Gettering, Silicon Bonding, Si-Si Interface

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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