Preface Committees
Future Challenges for Cleaning in Advanced Microelectronics
p.1
p.1
Open Circuit Potential Analysis as a Fast Screening Method for the Quality of High-k Dielectric Layers
p.7
p.7
Wet Etch Enhancement of HfO2 Films by Implant Processing
p.11
p.11
Behaviour of High-k Dielectric Materials with Classical Cleaning Chemistries
p.15
p.15
Introduction of High-k Materials into Wet Processing, Analysis and Behavior
p.19
p.19
Metallic Impurity Contamination from Tungsten Gate Cleaning
p.23
p.23
Single Chemistry Cleaning Solutions for Advanced Wafer Cleaning
p.27
p.27
Single Chemistry Cleaning with Complexing Agents (CAs): Determination of CA-Lifetimes by UV/VIS-Spectroscopy
p.33
p.33
Behaviour of High-k Dielectric Materials with Classical Cleaning Chemistries
Abstract:
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Periodical:
Solid State Phenomena (Volume 92)
Pages:
15-18
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Online since:
May 2003
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© 2003 Trans Tech Publications Ltd. All Rights Reserved
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