A Theoretical and Experimental Study of Damage-Free BEOL Cleaning with Megasonic Agitation
p.151
p.151
Removal of Small (<100-nm) Particles and Metal Contamination in Single-Wafer Cleaning Tool
p.157
p.157
Relation between Particle Density and Haze on a Wafer: a New Approach to Measuring Nano-Sized Particles
p.161
p.161
TXRF Analysis of Low Z Elements and TXRF-NEXAFS Speciation of Organic Contaminants on Silicon Wafer Surfaces Excited by Monochromatized Undulator Radiation
p.165
p.165
Forced Vapour-Phase Decomposition (FVPD) in Combination with e.g. TXRF - a Method to Determine Contamination in Silicon
p.171
p.171
On-Tool Real-Time Moisture Monitoring Provides Yield and Productivity Benefits
p.175
p.175
Effect of Preparation-Induced Surface Morphology on the Stability of H-Terminated Si(111) and Si(100) Surfaces
p.179
p.179
Thermal Evolution of (100) Silicon and Chemical Oxides as Seen by ATR Spectroscopy
p.183
p.183
Modelling the Growth of Chemical Oxide for Advanced Surface Preparation
p.187
p.187
Forced Vapour-Phase Decomposition (FVPD) in Combination with e.g. TXRF - a Method to Determine Contamination in Silicon
Abstract:
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Periodical:
Solid State Phenomena (Volume 92)
Pages:
171-174
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Online since:
May 2003
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© 2003 Trans Tech Publications Ltd. All Rights Reserved
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