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Advances in Nanomaterials and Processing

Solid State Phenomena Volumes 124 - 126

• Papers
• Abstracts

• p-2 Committees   [ 8 K ]
• p0 Preface   [ 7 K ]
• p1 Dependence of Thermal-Cycling-Induced Deformation on Passivation Morphology in Plastic-Encapsulated Microelectronic Devices   [ 297 K ]
  Authors: Seong Min Lee
• p5 Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test   [ 1 M ]
  Authors: Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung
• p9 Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines   [ 968 K ]
  Authors: Min Seung Yoon, Oh Han Kim, Young Chang Joo, Young Bae Park
• p13 Electrical Properties of ZrO₂ Capacitor Dielectrics Deposited by rf Magnetron Sputtering   [ 181 K ]
  Authors: Chong Mu Lee, Keun Bin Yim, Anna Park, Ho Jin Kim
• p17 Role of SrRuO₃ Buffer Layers in Enhancing Resistance Changing of Pr_0.7Ca_0.3MnO₃ Films   [ 211 K ]
  Authors: Seung Woo Han, Kyoung Wan Park, Jung Hyun Sok
• p21 Electrical Switching Characteristics of Nitrogen Doped Ge₂Sb₂Te₅ Based Phase Change Random Access Memory Cell   [ 1 M ]
  Authors: Myoung Sub Kim, Jin Hyung Jun, Jin Ho Oh, Hyeong Joon Kim, Jae Sung Roh, Suk Kyoung Hong, Doo Jin Choi
• p25 Bump Formation and Flip Chip Processes for RF System-on-Packages   [ 831 K ]
  Authors: Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh
• p29 Dislocation-Free Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Embedded Flash Memory   [ 291 K ]
  Authors: Nam Hoon Kim, Hae Young Yoo, Eui Goo Chang
• p33 Dependency of Electrical Characteristics on Au Nano-Crystal Size for Non-Volatile Memory Fabricated with Au Nano-Crystal Embedded in PVK(Poly(N-Vinylcarbazole)) Layer   [ 546 K ]
  Authors: Chang Kyu Lee, Jong Sung Kwon, In Chul Na, Byung Il Han, Young Min Kim, Jea Gun Park
• p37 Thermal Stress Model for Phase Change Random Access Memory   [ 274 K ]
  Authors: Sung Soon Kim, Jun Hyun Bae, Woo Hyuck Do, Kyun Ho Lee, Young Tae Kim, Young Kwan Park, Jeong Taek Kong, Hong Lim Lee
• p41 Improvement of Surface Morphologies of Ru Thin Films by 2-Step MOCVD Process Using (2,4-Demethylpentadienyl)(Ethylcyclopentadienyl)Ruthenium and Oxygen   [ 3 M ]
  Authors: Beom Seok Kim, Cheol Seong Hwang, Hyeong Joon Kim
• p45 AEM Study on the Phase Transformation of Nickel Silicides in the Ni_1-xTa_x/Si System   [ 942 K ]
  Authors: J.W. Lee, Cheol Woong Yang
• p49 Effects of Electroplating Parameters on the Defects of Copper via for 3D SiP   [ 484 K ]
  Authors: Byeong Hoon Cho, Won Jong Lee, Jae Ho Lee