Solid State Phenomena

Paper Title	Page
Committees
Preface
Dependence of Thermal-Cycling-Induced Deformation on Passivation Morphology in Plastic-Encapsulated Microelectronic Devices Authors: Seong Min Lee	1
Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test Authors: Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung	5
Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines Authors: Min Seung Yoon, Oh Han Kim, Young Chang Joo, Young Bae Park	9
Electrical Properties of ZrO₂ Capacitor Dielectrics Deposited by rf Magnetron Sputtering Authors: Chong Mu Lee, Keun Bin Yim, Anna Park, Ho Jin Kim	13
Role of SrRuO₃ Buffer Layers in Enhancing Resistance Changing of Pr_0.7Ca_0.3MnO₃ Films Authors: Seung Woo Han, Kyoung Wan Park, Jung Hyun Sok	17
Electrical Switching Characteristics of Nitrogen Doped Ge₂Sb₂Te₅ Based Phase Change Random Access Memory Cell Authors: Myoung Sub Kim, Jin Hyung Jun, Jin Ho Oh, Hyeong Joon Kim, Jae Sung Roh, Suk Kyoung Hong, Doo Jin Choi	21
Bump Formation and Flip Chip Processes for RF System-on-Packages Authors: Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh	25
Dislocation-Free Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Embedded Flash Memory Authors: Nam Hoon Kim, Hae Young Yoo, Eui Goo Chang	29

Paper Title

Page

Dependence of Thermal-Cycling-Induced Deformation on Passivation Morphology in Plastic-Encapsulated Microelectronic Devices

Authors: Seong Min Lee

Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test

Authors: Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung

Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines

Authors: Min Seung Yoon, Oh Han Kim, Young Chang Joo, Young Bae Park

Electrical Properties of ZrO₂ Capacitor Dielectrics Deposited by rf Magnetron Sputtering

Authors: Chong Mu Lee, Keun Bin Yim, Anna Park, Ho Jin Kim

Role of SrRuO₃ Buffer Layers in Enhancing Resistance Changing of Pr_0.7Ca_0.3MnO₃ Films

Authors: Seung Woo Han, Kyoung Wan Park, Jung Hyun Sok

Electrical Switching Characteristics of Nitrogen Doped Ge₂Sb₂Te₅ Based Phase Change Random Access Memory Cell

Authors: Myoung Sub Kim, Jin Hyung Jun, Jin Ho Oh, Hyeong Joon Kim, Jae Sung Roh, Suk Kyoung Hong, Doo Jin Choi

Bump Formation and Flip Chip Processes for RF System-on-Packages

Authors: Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh

Dislocation-Free Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Embedded Flash Memory

Authors: Nam Hoon Kim, Hae Young Yoo, Eui Goo Chang

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