Main Theme:

Advances in Nanomaterials and Processing

Volumes 124 - 126
doi: 10.4028/www.scientific.net/SSP.124-126
Paper Titles published in this Main Theme:
Paper Title Page

Committees

Preface

Dependence of Thermal-Cycling-Induced Deformation on Passivation Morphology in Plastic-Encapsulated Microelectronic Devices

Authors: Seong Min Lee

1

Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test

Authors: Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung

5

Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines

Authors: Min Seung Yoon, Oh Han Kim, Young Chang Joo, Young Bae Park

9

Electrical Properties of ZrO2 Capacitor Dielectrics Deposited by rf Magnetron Sputtering

Authors: Chong Mu Lee, Keun Bin Yim, Anna Park, Ho Jin Kim

13

Role of SrRuO3 Buffer Layers in Enhancing Resistance Changing of Pr0.7Ca0.3MnO3 Films

Authors: Seung Woo Han, Kyoung Wan Park, Jung Hyun Sok

17

Electrical Switching Characteristics of Nitrogen Doped Ge2Sb2Te5 Based Phase Change Random Access Memory Cell

Authors: Myoung Sub Kim, Jin Hyung Jun, Jin Ho Oh, Hyeong Joon Kim, Jae Sung Roh, Suk Kyoung Hong, Doo Jin Choi

21

Bump Formation and Flip Chip Processes for RF System-on-Packages

Authors: Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh

25

Dislocation-Free Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Embedded Flash Memory

Authors: Nam Hoon Kim, Hae Young Yoo, Eui Goo Chang

29

Showing 1 to 10 of 461 Paper Titles