Advances in Abrasive Technology XIII

Volumes 126-128

doi: 10.4028/www.scientific.net/AMR.126-128

Paper Title Page

Authors: Fang Hong Sun, Bin Shen, Guo Dong Yang

Abstract: To evaluate the cutting performance of CVD diamond coated silicon nitride insert, two kinds of CVD diamond films, namely microcrystalline...

226
Authors: Takahiro Takechi, Junichi Tamaki, Akihiko Kubo, A.M.M. Sharif Ullah

Abstract: Single-point fly cutting and nanoindentation test of quartz glass were performed using three different cutting tools, namely, a V-shaped...

235
Authors: Sheng Qiang Jiang, Yuan Qiang Tan, Gao Feng Zhang, Rui Tao Peng, Dong Min Yang

Abstract: In this paper, the technology of pre-stressed machining suitable for ceramic materials was presented. Using the cluster method, the discrete...

241
Authors: Hiroo Shizuka, Koichi Okuda, Masayuki Nunobiki, Wei Li, Takanobu Inaoka

Abstract: This paper describes the cutting characteristics of lithium niobate, which is used for surface acoustic wave type micropumps, regarding the...

246
Authors: Keisuke Hara, Hiromi Isobe, Shuichi Chiba, Keiko Abe

Abstract: This paper describes ultrasonically assisted fly cutting for finishing advanced ceramics for hot-press dies used to fabricate glass lenses....

252
Authors: Yan Ming Quan, Jia Jia Chen, Hao Xu

Abstract: Making holes in glass or ceramic with conventional twist drills is difficult because of the hard and brittle properties of the workpieces,...

258
Authors: Jhy Cherng Tsai, Hong Shin Chen

Abstract: This research investigates machining schemes for dicing soda lime glass in order to reduce the damage in the processes. Ductile machining...

263
Authors: Hung Jung Tsai, Jeng Haur Horng, Hung Cheng Tsai, Shun Jung Chiu, Pay Yau Huang

Abstract: Chemical mechanical polishing has been widely used to achieve global planarization of wafers. In this paper, an improved designed test rig...

271
Authors: Shih Hsiang Chang

Abstract: It is well known that dishing occurring in chemical mechanical polishing of plug structures leads to considerable wafer surface...

276
Authors: Zhen Zhong Wang, Yong Bo Wu, Li Bo Zhou, Yin Biao Guo, Chen Xu Wu

Abstract: As a new fixed-abrasive machining method, chemo-mechanical grinding (CMG) is developed from chemical mechanical polishing (CMP), with the...

282

Showing 41 to 50 of 169 Paper Titles