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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 276On-Chip Tensile Testing of the Mechanical and...

On-Chip Tensile Testing of the Mechanical and Electro-Mechanical Properties of Nano-Scale Silicon Free-Standing Beams

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Abstract:

A simple and versatile on-chip tensile testing method is proposed for the statistical evaluation of size effects on the mechanical strength of silicon thin films along with the simultaneous study of (from low to ultra) strain effects on the carrier transport. Mechanical results are presented on the fracture strength of micro-nano scale silicon beams, followed with a discussion on interface states and problems facing reliable nano-electronic and nano-electromechanical characterizations.

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Nanoscaled Semiconductor-on-Insulator Materials, Sensors and Devices

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Periodical:

Advanced Materials Research (Volume 276)

Pages:

117-126

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.276.117

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Online since:

July 2011

Authors:

Umesh Bhaskar, Vikram Passi, Azeem Zulfiqar, Ulf Södervall, Bengt Nilsson, Goran Petersson, Mats Hagberg, Thomas Pardoen, Jean Pierre Raskin

Keywords:

Environmental Impact on Measurement, Fracture, Fracture Strength of Silicon, Mechanical and Electro-Mechanical Properties of Silicon, MEMS/NEMS, Nano-Mechanical Testing, On-Chip Tensile Testing, Piezoresistivity, Silicon Nanowire, Surface States, Thin Film Testing

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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