Surface Finishing Technology and Surface Engineering

Volumes 53-54

doi: 10.4028/

Paper Title Page

Authors: Jian Xiu Su, Xi Qu Chen, Jia Xi Du, Dong Ming Guo, Ren Ke Kang

Abstract: Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer. The nonuniformity of...

Authors: Chi Xu, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin, Feng Wei Huo

Abstract: Chemical mechanical polishing (CMP) has been extensively used in the integrate circuit (IC) manufacturing industry as a widely accepted...

Authors: Cong Rong Zhu, Bing Hai Lv, Ju Long Yuan

Abstract: Studies on chemical mechanical polishing (CMP) for silicon nitride (Si3N4) balls with CeO2 abrasive carried to investigate the mechanism of...

Authors: Y. Chen, X. Wang, C.J. Zhang

Abstract: It is very difficult matter that polishes the internal surface of the pipe, especially to the thin pipe with the traditional surface...

Authors: Ju Long Yuan, Li Tao, Zhi Wei Wang, Qian Fa Deng, Feng Chen, Ping Zhao

Abstract: The amorphous Ni-Pd-P alloy films with superior property have good heat conductivity and wear performance. They are widely used in the...

Authors: Zhao Zhong Zhou, Ju Long Yuan, Bing Hai Lv, Jia Jin Zheng

Abstract: To study the sphere-shaping mechanism under dual rotating plates (DRP) lapping mode for ceramic balls, the uniformity of lapping trace...

Authors: Qiu Sheng Yan, Ai Jun Tang, Jia Bin Lu, Wei Qiang Gao

Abstract: A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented...

Authors: Ju Long Yuan, Dong Qiang Yu, Zhi Wei Wang, Yi Yang, Miao Qian, Bing Hai Lv

Abstract: The semibonded abrasive machining technique is expected to get high surface integrity and processing efficiency attributed to the „trap‟...

Authors: Yu Li Sun, Dun Wen Zuo, Yong Wei Zhu, Ming Wang, H.Y. Wang, Li Gang Zhao

Abstract: The friction behavior of single silicon wafer sliding against different ice counterparts (α-Al2O3, CeO2 and SiO2) at 10±0.5 °C within a...

Authors: Ju Long Yuan, Yi Yang, Zhi Wei Wang, Dong Qiang Yu, Miao Qian, Yong Dai

Abstract: This work aims to obtain fine surface of silicon wafer during precision and ultra precision machining, and presents a new method called...


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