Advances in Abrasive Technology XII

Volumes 76-78

doi: 10.4028/

Paper Title Page

Authors: Cheng Yi Shih, Pei Lum Tso, James C. Sung

Abstract: Current polishing pads cannot polish a workpiece without using slurry with free abrasive. The new slurry is required to be continually...

Authors: Viboon Tangwarodomnukun, Jun Wang

Abstract: Laser micromachining has been widely used for micro-component fabrication of various materials, such as silicon substrates where silicon...

Authors: Chao Chang Arthur Chen, Bing Lin Kuo, Jiun Shuo Liang

Abstract: Multi-wire sawing process with slurry has been popularly adopted for wafer slicing of silicon substrates for solar cells. This paper is to...

Authors: H. Takahashi, Y.B. Tian, J. Sasaki, Jun Shimizu, Li Bo Zhou, Y. Tashiro, Hisao Iwase, Sumio Kamiya

Abstract: Chemo-mechanical grinding (CMG) process is a promising process for large-sized Si substrate fabrication at low cost. An encountered issue in...

Authors: Y.B. Tian, Li Bo Zhou, Jun Shimizu, H. Sato, Ren Ke Kang

Abstract: The demand for extremely-thin Si wafers is expanding. Current manufacturing technologies are meeting great challenges with the continuous...

Authors: Hirofumi Hidai, Taro Sugita, Hitoshi Tokura

Abstract: Polycrystalline ingot slicing by wire electric discharge machining (W-EDM) has been investigated to reduce kerf loss and wafer thickness. In...

Authors: Li Bo Zhou, Takahito Mitsuta, Jun Shimizu, Takuji Tajima

Abstract: Many models [1-3] have been proposed to study the infeed grinding of Si wafers and to understand its effects on the surface generation. ...

Authors: Ji Wang Yan, Sei Ya Muto, Tsunemoto Kuriyagawa

Abstract: Ultraprecision diamond-ground silicon wafers were irradiated by a high-frequency nanosecond pulsed Nd:YAG laser equipped on a four-axis...

Authors: Jae Won Baik, Chang Wook Kang

Abstract: Chemical mechanical polishing (CMP) is a technique used in semiconductor fabrication for planarizing the top surface of an in-process...

Authors: Dennis V. de Pellegrin, Andrew Torrance

Abstract: The principle of stereopsis involves measuring an object’s geometry from a pair of images taken at slightly different viewing positions....


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