Non-Destructive Quantification of In-Plane Depth Distribution of Sub-Surface Damage on 4H-SiC Wafers Using Laser Light Scattering

Abstract:

The development of non-destructive quantitative evaluation techniques for the in-plane depth distribution of sub-surface damage (SSD) layer induced by mechanical processing of chemical mechanical polishing (CMP) finished SiC wafers is essential to reduce the occurrence of crystal defects during epitaxial growth. Until now, no wafer inspection method has been able to nondestructively and quantitatively assess the in-plane depth distribution of the SSD. This study investigates the correlation between the scattered light intensity measured nondestructively by the Laser light scattering (LLS) method and the SSD depth estimated by destructive inspection using the Dynamic AGE-ing^® method, a sublimation-controlled etching and growth process, to develop a novel non-destructive SSD inspection method. As a result, it was found that there is an exponential relationship between the scattered light intensity by the LLS method on the bare wafer surface and the depth of the SSD layer that contributes to the formation of in-grown stacking faults (IGSF) during subsequent epitaxial growth. The results show that SiC wafer inspection using the novel LLS method, which introduces this relational equation, enables non-destructive and quantitative evaluation of SSD depth and in-plane distribution.

• Periodical: Defect and Diffusion Forum (Volume 434)
• Pages: 157-163
• DOI: https://doi.org/10.4028/p-cSR8Qq
• Online since: August 2024
• Authors: Daichi Dojima*, Koki Shigematsu, Kaito Tayake, Kohei Toda, Tadaaki Kaneko
• Keywords: Basal Plane Dislocation, Chemical Mechanical Polishing, Dynamic AGE-Ing^®, Epitaxial Growth, In-Grown Stacking Fault, Machining Process, Thermal Etching, Wafer Inspection

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