Paper Title
Authors: Job Ha, Kyung Young Jhang
Abstract:The linear ultrasonic technique has been extensively used as a powerful, non-destructive test tool for reliability testing and failure...
Authors: Yu Ting He, F. Li, Rong Shi, G.Q. Zhang, L.J. Ernst, Jack Zhang, Zhi Tang Song
Abstract:Passivation crack is one of the main failures of micro-electronics. And the IC interconnect has a large varying range values comparing with...
Authors: Tae Kyung Hwang, Soon Bok Lee
Abstract:The leading candidates for replacing lead-contained solders are near ternary eutectic Sn/Ag/Cu alloys. The electronic industry has begun to...
Authors: Il Ho Kim, Tae Sang Park, Se Young Yang, Soon Bok Lee
Abstract:Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which...
Authors: Takashi Hasegawa, Masumi Saka
Abstract:Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is...
Authors: Ishak Abdul Azid, C.P. Tan, Boon Leong Lee, K.N. Seetharamu, Manimaran Ratnam, M.V.V. Murthy
Abstract:Delamination and crack were considered as significant failures in electronic packaging. For these circumstances, Modified Crack Closure...
Authors: Jong Woong Kim, Sun Kyu Park, Seung Boo Jung
Abstract:Ball shear test was investigated in terms of effects of important test parameters, i.e. shear height and shear speed, with an experimental...
Authors: Dae Gon Kim, Hyung Sun Jang, Jong Woong Kim, Seung Boo Jung
Abstract:In the present work, we investigated the interfacial reactions and shear properties between Sn-3.0Ag-0.5Cu flip chip solder bump and Cu UBM...
Authors: Jung Hee Cho, Bang Kwon Kang, Kyung Soo Kim, Kyoung Bog Jin, Sae Hoon Kim, Won Youl Choi
Abstract:Metal leadframes (Alloy 42) were cleaned using atmospheric pressure glow discharge plasma. Atmospheric pressure glow plasma was generated by...
Showing 131 to 140 of 468 Paper Titles