A Novel Technique for Shallow Angle Beveling of SiC to Prevent Surface Breakdown in Power Devices

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Periodical:

Materials Science Forum (Volumes 353-356)

Edited by:

G. Pensl, D. Stephani and M. Hundhausen

Pages:

623-626

DOI:

10.4028/www.scientific.net/MSF.353-356.623

Citation:

J. N. Merrett et al., "A Novel Technique for Shallow Angle Beveling of SiC to Prevent Surface Breakdown in Power Devices", Materials Science Forum, Vols. 353-356, pp. 623-626, 2001

Online since:

January 2001

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$35.00

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