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HomeMaterials Science ForumMaterials Science Forum Vols. 433-436The Effect of Thermal Gradients on SiC Wafers

The Effect of Thermal Gradients on SiC Wafers

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Silicon Carbide and Related Materials - 2002

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Periodical:

Materials Science Forum (Volumes 433-436)

Pages:

193-196

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.433-436.193

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Online since:

September 2003

Authors:

Christer Hallin, Torbjörn Joelsson, Erik Janzén

Keywords:

Curvature, Thermal Strain

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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