Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique

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Periodical:

Materials Science Forum (Volumes 433-436)

Edited by:

Peder Bergman and Erik Janzén

Pages:

361-364

DOI:

10.4028/www.scientific.net/MSF.433-436.361

Citation:

X. Y. Ma et al., "Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique", Materials Science Forum, Vols. 433-436, pp. 361-364, 2003

Online since:

September 2003

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$35.00

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