Simple, Calibrated Analysis and Mapping of SiC Wafer Defects by Birefringence Imaging

Abstract:

Article Preview

Info:

Periodical:

Materials Science Forum (Volumes 527-529)

Edited by:

Robert P. Devaty, David J. Larkin and Stephen E. Saddow

Pages:

721-724

DOI:

10.4028/www.scientific.net/MSF.527-529.721

Citation:

S. H. Park et al., "Simple, Calibrated Analysis and Mapping of SiC Wafer Defects by Birefringence Imaging", Materials Science Forum, Vols. 527-529, pp. 721-724, 2006

Online since:

October 2006

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.