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HomeMaterials Science ForumMaterials Science Forum Vols. 527-529Simple, Calibrated Analysis and Mapping of SiC...

Simple, Calibrated Analysis and Mapping of SiC Wafer Defects by Birefringence Imaging

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Silicon Carbide and Related Materials 2005

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Periodical:

Materials Science Forum (Volumes 527-529)

Pages:

721-724

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.527-529.721

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Online since:

October 2006

Authors:

Seung Ho Park, Mark J. Loboda, Michael J. Spaulding

Keywords:

Birefringence, Defect Free Area, Wafer Map

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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