Progress in Growth of Thick Epitaxial Layers on 4 Degree Off-Axis 4H SiC Substrates

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Abstract:

This paper reports the progress of the thick epitaxy development at Dow Corning. Epiwafers with thickness of 50 – 100 m have been grown on 4° off-axis 76mm 4H SiC substrates. Smooth surface with RMS roughness below 1nm and defect density down to 2 cm-2 are achieved for 80 - 100 m thick epiwafers. Long carrier lifetime of 2 – 4 s are routinely obtained, and low BPD density in the range of 50 down to below 10 cm-2 is confirmed. High voltage JBS diodes have been successfully fabricated on these wafers with thick epitaxial layers.

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Materials Science Forum (Volumes 717-720)

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137-140

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May 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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