Study of High Temperature Microwave Annealing on the Performance of 4H-SiC MOS Capacitors

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Abstract:

The strong covalent bond of SiC imposes harsh post implantation annealing condition requirement for SiC MOS devices. As a consequence the effect of the annealing conditions on the channel region of the MOS devices becomes critical. High temperature microwave annealing has been shown to be an attractive alternative to conventional thermal annealing techniques. The effect of high temperature rapid microwave annealing on the performance of 4H-SiC MOS capacitors has been studied in this paper. Annealing temperatures ranging from 1600°C up to 2000°C for 30secs is used and the effect of annealing conditions is studied via C-V measurements on MOS capacitors.

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Materials Science Forum (Volumes 717-720)

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769-772

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May 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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