Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range

Satoshi Tanimoto; Kohei Matsui; Yusuke Zushi; Shinji Sato; Yoshinori Murakami; Masato Takamori; Takashi Iseki

doi:10.4028/www.scientific.net/MSF.717-720.853

Paper Titles

Electroless Nickel for N-Type Contact on 4H-SiC
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Development of an Extreme High Temperature n-Type Ohmic Contact to Silicon Carbide
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Investigation of Ti₃SiC₂ MAX Phase Formation onto N-Type 4H-SiC
p.845

GaZnO as a Transparent Electrode to Silicon Carbide
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Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range
p.853

Metal Work-function and Doping-Concentration Dependent Barrier Height of Ni-Contacts to 4H-SiC with Metal-Embedded Nano-Particles
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Cutting Speed of Electric Discharge Machining for SiC Ingot
p.861

Cutting of SiC Wafer by Atmospheric-Pressure Plasma Etching with Wire Electrode
p.865

Curious Relationship between Orientation of SiC Substrates and Chemical Reactivity
p.869

HomeMaterials Science ForumMaterials Science Forum Vols. 717-720Common Metal Die Attachment for SiC Power Devices...

Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range

Abstract:

A new high-temperature die attachment system that is cost effective has been strongly desired for SiC power applications in electric vehicles and consumer electronics. This paper presents preliminary results for SiC/Zn-Al/Cu-SiN die attachments using eutectic Zn-Al solder (m.p. = 356°C), focusing on preparation and die-shear reliability. Superior wettability and reproducibility were achieved in the soldering process. It was found that the attachments were viable at least for short-term application in a temperature range up to 300°C. Reliability test results revealed that they could withstand storage for 1500 hours at 200°C and thermal cycle stress of 1500 cycles between –40°C and 200°C.

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Periodical:

Materials Science Forum (Volumes 717-720)

Pages:

853-856

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.717-720.853

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Cite this paper

Online since:

May 2012

Authors:

Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, Takashi Iseki

Keywords:

Common Metal, Die Attachment, High-Temperature, Package, Power Device, Solder, Zn-Al

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