Stability of Current Gain in SiC BJTs

Article Preview

Abstract:

In this work, large area SiC BJTs with good long-term stability in 1000 hrs DC stress tests are demonstrated. It is also illustrated how wafer scanning techniques can be used to reject BJT dies with basal plane dislocations, thereby eliminating the risk for bipolar degradation.

You might also be interested in these eBooks

Info:

Periodical:

Materials Science Forum (Volumes 778-780)

Pages:

1017-1020

Citation:

Online since:

February 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] P. G. Muzykov, R. M. Kennedy, Q. Zhang, C. Capell, A. Burk, A. Agarwal, T. S. Sudarshan, Microelectron. Reliab. 49, 32-37 (2009).

Google Scholar

[2] Y. Gao, A. Q. Huang, Q. Zhang, S. Krishnaswami, A. K. Agarwal, Proc. 19th Int. Symp. Power Semiconductor Devices ICs, 121-124 (2007).

Google Scholar

[3] A. Agarwal, S. Krishnaswami, J. Richmond, C. Capell, S. -H. Ryu, J. Palmour, K. Jones, and C. Scozzie, Material Research Society Symposium Proceeding, 911, 431-436 (2006).

DOI: 10.1557/proc-0911-b11-04

Google Scholar

[4] S. Sundaresan, A. Soe, S. Jeliazkov, R. Singh, IEEE Transactions on Electron Devices, Vol. 59, No. 10, 2795-2802 (2012).

DOI: 10.1109/ted.2012.2210048

Google Scholar

[5] A. Agarwal, S. Krishnaswami, J. Richmond, C. Capell, S. -H. Ryu, J. Palmour, B. Geil, D. Katsis, C. Scozzie, Mater. Sci. Forum, 527-529, 1409-1412 (2006).

DOI: 10.4028/www.scientific.net/msf.527-529.1409

Google Scholar

[6] L. Farese, G. Malm, M. Domeij, M. Östling, Mater. Sci. Forum, 645-648, 1037-1040 (2010).

DOI: 10.4028/www.scientific.net/msf.645-648.1037

Google Scholar

[7] A. Konstantinov, M. Domeij, C. Zaring, I. Keri, J.O. Svedberg, K. Gumaelius, M. Östling, M. Reimark, Mater. Sci. Forum, 645-648, 1057-1060 (2010).

DOI: 10.4028/www.scientific.net/msf.645-648.1057

Google Scholar

[8] R.E. Stahlbush, K.X. Liu, Q. Zhang, J.J. Sumakeris, Mater. Sci. Forum, 556-557, 295-298 (2007).

Google Scholar