Analysis Self-Healing of Gate Leakage Current due to Oxide Traps to Improve Reliability of Gate Electrode

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To achieve robust SiC-MOSFET, reliability of the gate insulator was investigated in terms of gate electrode edge treatment. Analytical calculation showed that r should be larger than the thickness of gate insulator to relax the electric field concentration. We obtained the rounded gate edge by dry oxidation at 1000°C, while oxidation at 800°C had it sharpened. Former samples exhibited low leakage current with Time-Zero-Dielectric-Breakdown (TZDB) measurement. Ig consisted of Fowler-Nordheim (FN) tunneling current for Vg > 0, and it includes excess components for Vg < 0. We confirmed that they occurred at the gate edge and that they coursed positively charged trap centers in oxide near poly-Si/SiO2 interface which caused local barrier lowering. Electron injection removed them by tunneling/recombination process, which followed tunneling-front model.

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541-544

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May 2017

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© 2017 Trans Tech Publications Ltd. All Rights Reserved

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[1] Bhatnagar, M., & Baliga, B. J. (1993). Comparison of 6H-SiC, 3C-SiC, and Si for power devices. IEEE Transactions on Electron Devices, 40(3), 645-655.

DOI: 10.1109/16.199372

Google Scholar

[2] Chung, G. Y., Tin, C. C., Williams, J. R., McDonald, K., Chanana, R. K., Weller, R. A., .. & Palmour, J. W. (2001).

Google Scholar

[3] Cooper, J. A., & Agarwal, A. (2002). SiC power-switching devices-the second electronics revolution?. Proceedings of the IEEE, 90(6), 956-968.

DOI: 10.1109/jproc.2002.1021561

Google Scholar

[4] Hong, J. D., Davis, R. F., & Newbury, D. E. (1981). Self-diffusion of silicon-30 in α-SiC single crystals. Journal of Materials Science, 16(9), 2485-2494.

DOI: 10.1007/bf01113585

Google Scholar

[5] Yamabe, K., & Imai, K. (1987). Nonplanar oxidation and reduction of oxide leakage currents at silicon corners by rounding-off oxidation. IEEE Transactions on Electron Devices, 34(8), 1681-1687.

DOI: 10.1109/t-ed.1987.23137

Google Scholar

[6] Imai, K., & Yamabe, K. (1990). Nonplanar silicon oxidation in dry O2+ NF3. Applied physics letters, 56(3), 280-282.

DOI: 10.1063/1.102808

Google Scholar

[7] McLean, F. B. (1976). A direct tunneling model of charge transfer at the insulator-semiconductorinterface in MIS devices (No. HDL-TR-1765). HARRY DIAMOND LABS ADELPHI MD.

Google Scholar

[8] Benedetto, J. M., Boesch, H. E., McLean, F. B., & Mize, J. P. (1985). Hole removal in thin-gate MOSFETs by tunneling. IEEE Transactions on Nuclear Science, 32(6), 3916-3920.

DOI: 10.1109/tns.1985.4334043

Google Scholar

[9] Maserjian, J., & Zamani, N. (1982). Observation of positively charged state generation near the Si/SiO2 interface during Fowler–Nordheim tunneling. Journal of Vacuum Science & Technology, 20(3), 743-746.

DOI: 10.1116/1.571448

Google Scholar