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HomeSolid State PhenomenaSolid State Phenomena Vols. 103-104Process, Environmental & Economical Considerations...

Process, Environmental & Economical Considerations to Implement Single Wafer Cleaning Tools in 300mm Wafer Fabs

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Ultra Clean Processing of Silicon Surfaces VII

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

41-44

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.41

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Online since:

April 2005

Authors:

Philippe Garnier, G. Horellou, J.J. Calvier, D. Labaty, Didier Lévy

Keywords:

Cost of Ownership, Cycle Time, DIW Consumption, Environment, Single Wafer Cleaning

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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[1] P.Boelen & al. Solid State Phenomena Vol.92 (2003) pp.49-52 online at http://www.scientific.net.

[2] O.Bonin & al., IEEE Trans. On Semiconductor Manufacturing, vol 16, 2003, p.111. FEOL HFRCA-like Recipes 0 10 20 30 40 50 60 70 80 90 61 22 55 0 Wafers / run Cycle Time in min. Batch Single Wafer