Paper Titles

I: Ultra-Shallow Junction Cleaning: Metrology for Evaluating Dopant Loss and Substrate Erosion
p.129

II: Ultra-Shallow Junction Cleaning: Methodologies for Process and Chemistry Optimization
p.133

Effect of Dopants on the Dissolution Behavior of Silicon Substrates in HF-Based Cleaning Solutions
p.139

The Effect of Various Process Induced Damages on Wet Etching Rate Difference
p.143

How Bubbles (Can) Clean
p.151

Aging Phenomena in the Removal of Nano-Particles from Si Wafers
p.155

Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP
p.159

Particle-Substrate Interaction Forces in a Non-Polar Liquid
p.165

Interaction Forces between Oxide and Silica-Modified Terpolymer Abrasive and their Impact on CMP and Post-CMP
p.169

HomeSolid State PhenomenaSolid State Phenomena Vol. 134How Bubbles (Can) Clean

How Bubbles (Can) Clean

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Ultra Clean Processing of Semiconductor Surfaces VIII

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Solid State Phenomena (Volume 134)

Pages:

151-153

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.151

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Online since:

November 2007

Authors:

Claus Dieter Ohl, Rory Dijkink, Manish Arora, Detlef Lohse

Keywords:

Cavitation, Flow Visualization, Jet

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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[1] D. Krefting, R. Mettin and W. Lauterborn, Ultrasonics Sonochem. 11 (2004), p.119. V.S. Moholkar, M.M.C.G. Warmoeskerken, C.D. Ohl and A. Prosperetti, Am. Inst. Chem. Eng. J. 50 (2004), p.58.

[2] G.W. Gale and A.A. Busnaina, Part. Sci. Tech. 13 (1995), p.1196.

[3] G.W. Ferrell and L.A. Crum, J. Acoust. Soc. Am. 112 (2002), p.1196.

[4] J.R. Blake, G.S. Keen, R.P. Tong, and M. Wilson, Phil. Trans. Roy. Soc. Lond. A 357 (1999), p.251. E.A. Brujan, G.S. Keen, A. Vogel, and J.R. Blake, Phys. Fluids 14 (2002), p.85.

[5] B.W. Zeff, B. Kleber, J. Fineberg, and D.P. Lathrop, Nature 403 (2000), p.401.