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HomeSolid State PhenomenaSolid State Phenomena Vol. 134II: Ultra-Shallow Junction Cleaning: Methodologies...

II: Ultra-Shallow Junction Cleaning: Methodologies for Process and Chemistry Optimization

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

133-137

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.133

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Online since:

November 2007

Authors:

Aseem K. Srivastava, Ke Ping Han, Mike Ameen, Ivan L. Berry, Stu Rounds

Keywords:

Ashing, High Dose Implant Ash, Reactive Ion Etching, Substrate Damage, Zero Substrate Loss

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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Citation:

[1] Ameen et al. Ultrashallow junction cleaning: methodologies for process and chemistry optimization, this conference, (2006).

[2] US patent number 6, 057, 645.

[3] Srivastava, et al. A New Plasma Source for Photoresist Ash and Residue Removal, 1998 IEEE Conference on Plasma Sciences at Raleigh, North Carolina, USA.

[4] US patent number 6, 761, 796.