Paper Titles

Wafer Cleaning Using Supercritical CO₂ in Semiconductor and Nanoelectronic Device Fabrication
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All-Wet Stripping of FEOL Photoresist Using Mixtures of Sulphuric Acid
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All Wet Stripping of Implanted Photoresist
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Study of a Metal Gate and Silicon Selective “Dry Ash Only” Process for Combined Extension and Halo Implanted Photo Resist
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High Dose Implant Stripping and Residue Removal with Sequential Plasma and Vacuum Aerosol Processes
p.117

Confined Chemical Cleaning: A Novel Concept Evaluated for Front End of Line Applications
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Impact of RF Oxygen Plasma on Thermal Oxide Etch-Rate
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I: Ultra-Shallow Junction Cleaning: Metrology for Evaluating Dopant Loss and Substrate Erosion
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II: Ultra-Shallow Junction Cleaning: Methodologies for Process and Chemistry Optimization
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High Dose Implant Stripping and Residue Removal with Sequential Plasma and Vacuum Aerosol Processes

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Ultra Clean Processing of Semiconductor Surfaces VIII

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Periodical:

Solid State Phenomena (Volume 134)

Pages:

117-120

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.134.117

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Online since:

November 2007

Authors:

Karen A. Reinhardt, Khalid Makhamreh, George Tannous

Keywords:

Cryoaerosol, High Dose Implant Strip, Plasma Cleaning, Thermophoresis

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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